Abron BR 732 Bismaleimide Resin

Tough resin system with high Tg, Hot melt & Solvent processable, No volatiles during cure. Castings, Pre-pregs, Adhesive, etc.

APPLICATIONS :

• This resin system offers excellent thermal stability & performance at elevated temperatures (> 3000C). The laminates made using ABRON BR732 system exhibit outstanding toughness & moisture resistance. This resin system can be used for the manufacture of composites where high temperature resistance & good mechanical properties at elevated temperatures are desired.
• This resin can be used for advanced composite applications by prepreging technique. The resin system can be melt processed and can be used as a high temperature structural adhesive. The prepregs can be molded into laminates that find application in printed circuit boards. The resin system is also amenable for polar & filament winding applications. ABRON BR732 System also finds application as thermal resistant coatings.