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ABR Organics Limited

Bismaleimide Resin

Abron DGW 720 Bismaleimide Resin
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Product Details

Appearance Yellow to Orange Colour
State Powder
Bulk Density 0.5 – 0.8 gm/cc
Melting Point 80 – 110° C
Inherent Viscosity 0.03 – 0.06 dl/gm
Solubility Soluble IN DMF/DMAc/NMP
Cure Temperature 180 – 220 C

Fabrication of Diamond Grinding Wheels for Resin Bonded Diamond Abrasives.


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Abron BR 720 Bismaleimide Resin
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Product Details

Appearance Yellow to Orange Colour
State Powder
Bulk Density 0.5 – 0.8 gm/cc
Melting Point 80 – 110° C
Inherent Viscosity 0.03 – 0.06 dl/gm
Solubility Soluble IN DMF/DMAc/NMP
Free Mda Content < 0.12 %

Composites, Laminates for thermal & electrical insulation by pre-pegging and Compression Molding. Compatible with Carbon, Glass, Aramid & Silica Fabrics. No volatiles during cure.


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Abron BR 8100 Bismaleimide Resin
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Product Details

Appearance Transparent Brown Semi-solid resin
Melting Range 65 – 75°C
Volatiles < 1 %
Cure Temperature 180°C
Post Cure Temperature 200°C
Elongation 3%
Tg by DMA 275°C

Pre-pregging grade, Composites, VARTM, High Tg. Compatible with Carbon, Glass, Aramid & Silica Fabrics. Resin lumps soluble in Acetone / Methanol. Good Shelf Life of resin solution for 2 weeks at RT. 

 

ABRON BR 8100 is a modified Bismaleimide based resin that is a semi-solid at RT. The viscosity of Neat Resin will be 200 – 500 cPs at 75 – 850 C and can be used for VARTM application. No volatiles are released during cure. The resin is easily soluble in Acetone and can be used as a solution for prepregging. The Shelf Life of the resin in Acetone is 2 weeks when stored at 25C. 


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Abron BMI Regular Bismaleimide Resin
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Product Details

Iupac Name 1,1’-(methylene Di-4,1- Phenylene)bismaleimide
Appearance Fine Yellow Powder
CAS NO. [ 13676-54-5]
Formula Wt 358.36
Melting Point 146 – 156 ° C
Solubility Soluble in NMP/DMF/DMAc/ACETONE
Acid Value < 1 mg of KOH / gm
Purity > 95 % ( BY HPLC )

Bismaleimide is An Intermediate in the Production of Thermosetting Polyimide Resins, for Making Insulating Materials / Varnishes, Composites, Printed Circuit Boards, Potting Compounds, Etc. 


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Abron R 750 Bismaleimide Resin
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Product Details

State Fine Powder
Colour Light Pinkish Brown
Specific Gravity at 25 °C 1.1
Solubility NMP / DMF
Bulk viscosity of 40% Solution 40 – 100 CPs
Short Service Temperature -200 to +300 °C
Continuous Use Temp -200 to +300 °C

Polyimides are high and low temperature resistance rendering service from –250 to +350 °C. Polyimides are intractable, infusible and insoluble polymers resulting in processing of polyimides as impracticable. Extensive research has taken place in finding out ways and means of getting processable Polyimides without jeopardizing the thermal stability and mechanical properties at extreme temperatures. Indian Space Research Organisation has put considerable amount of R & D in this line and has successfully come out with a prepolymer of polyimide which has excellent processability, stability at room temperature and with moderate cure temperatures. The composite made with this prepolymer have yielded components for space and aerospace applications. ABRON-R 750 is being manufactured by M/s. ABR ORGANICS LIMITED, with the license from Indian Space Research Organisation.

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Abron BR 732 Bismaleimide Resin
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Product Details

State Fine Powder
Color Light yellow / cream
Melting Point 150 – 160° C
Bulk Density 0.2 – 0.3 gm /cc
Viscosity 13000 – 35000 cps
Odor Mild Phenolic

Tough resin system with high Tg, Hot melt & Solvent processable, No volatiles during cure. Castings, Pre-pregs, Adhesive, etc.

 

APPLICATIONS :

  • This resin system offers excellent thermal stability & performance at elevated temperatures (> 3000C). The laminates made using ABRON BR732 system exhibit outstanding toughness & moisture resistance. This resin system can be used for the manufacture of composites where high temperature resistance & good mechanical properties at elevated temperatures are desired.
  • This resin can be used for advanced composite applications by prepreging technique. The resin system can be melt processed and can be used as a high temperature structural adhesive. The prepregs can be molded into laminates that find application in printed circuit boards. The resin system is also amenable for ...

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